Semiconductor workshop

       Brief construction scheme of semiconductor device and wafer factory clean workshop:

       In the production process of semiconductor device wafers, the surface structure is easily damaged by foreign objects, dust particles, metal ions and other foreign objects, and this product characteristic also determines that there must be cleanliness requirements in the manufacturing process. At the same time, in the process of semiconductor wafer testing, the test room must also be placed in the clean room, and the control of cleanliness is equally important. If the cleanliness of the clean room is not well controlled, the dust content in the air will be too high, which will lead to the increase of foreign objects, thus affecting the accuracy and stability of the test, and even causing the damage of the probe test card.

       The most important function of the clean workshop is to control the cleanliness, temperature and humidity of the atmosphere in which the products (such as silicon chips) are exposed, so that the products can be produced in a good environmental space. In the wafer shop, in order to solve the problems of poor yield, unstable test results, damage of probe test cards and scrap of wafers, the design of clean room and auxiliary room is one of the primary tasks of factory construction. In strict accordance with the industry standards and specifications, the Code for Design of Silicon Integrated Circuit Chip Factory, the Code for Fire Protection Design of Buildings, the Code for Design of Clean Workshop of Electronic Industry and the Code for Design of Clean Workshop are carried out.

       The wafer workshop has strict control requirements for the temperature, humidity, cleanliness and anti-micro-vibration of the production environment, and various supporting systems are complex. The designers of the company will also adopt the FAB layout design, such as the vertical layout of the Fab building layout, the plane layout, the determination of the bottom column grid, the layout of the somebody support area, the layout of the fresh air room, the determination of the fire risk classification of the building fire protection, the design of the fire compartment, the design of the explosion prevention, the setting of the special fire outlet, etc.

       Most FAB plants have a four-layer structure, from top to bottom: upper technical layer, clean production layer, clean lower technical layer and non-clean lower technical layer.

       For detailed design points, please contact the construction engineer of the company's semiconductor workshop.

       Examples of clean workshop works are as follows: